The Redmi K70 Pro was just unveiled for the Chinese market a few hours ago, and already a local channel has performed a teardown of the device, showing all of its innards in all their glory.
This is undoubtedly the highest-end Redmi smartphone ever made, and it features what is currently the top chipset from Qualcomm, which is a first for the brand, definitely befitting its ten-year anniversary. Did we mention Redmi turned ten this year? Well, it did. Anyway, if you don’t speak Chinese, don’t worry – English closed captions are available, just hit the CC button in the player below.
The teardown reveals a lot of details about the components used for the phone, including the camera sensors and makers of all the various chipsets on board. It’s a very informative and fast paced journey, which we recommend embarking on.
To recap, the Redmi K70 Pro comes with a 6.67-inch 1440×3200 120 Hz OLED screen with 4,000-nit peak brightness, the Snapdragon 8 Gen 3 SoC, 12/16/24GB of RAM, 256GB/512GB/1TB of storage, a triple rear camera system (50 MP main with OIS, 12 MP ultrawide, 50 MP 2x optical zoom), a 16 MP selfie snapper, and a 5,000 mAh battery with support for 120W wired charging.
Laura Adams is a tech enthusiast residing in the UK. Her articles cover the latest technological innovations, from AI to consumer gadgets, providing readers with a glimpse into the future of technology.
